Á¦Ç°Á¤º¸
ºñ±³¸¦ °ÅºÎÇÏ´Â °æÀï·ÂÀ¸·Î ±â¼úÀ» ¼±µµÇÕ´Ï´Ù.
Target »ç¾÷
°¡°ø Bonding FSW
¿ÍÀÌ¿¥¾¾(ÁÖ)´Â Sputtering °øÁ¤ÀÇ ¹è¼±Àç·Î »ç¿ëµÇ´Â TargetÀ» ´Ù¾çÇÑ ¼ÒÀç ¹× Å©±â·Î ¾ç»êÇϰí ÀÖÀ¸¸ç, è¹ö ³» Target ÀåÂø ¹× Cooling ¿ªÇÒÀÇ Backing Plate¸¦ ±¹³» ÃÖÃÊ·Î ±¹»êÈÇÏ¿© ³ôÀº °æÀï·ÂÀ» °®Ãß°í ÀÖ½À´Ï´Ù.
Target°ú Backing Plate°£ Bonding±â¼úÀº ¼ö³â°£ ÃàÀûµÈ ³ëÇϿ츦 ¹ÙÅÁÀ¸·Î ±¹³» ÃÖ´ë Å©±â±îÁö ´ëÀÀ °¡´ÉÇÏ¸ç ´Ù¾çÇÑ ±â¼úÀû Áö¿øÀ» Á¦°øÇϰí ÀÖ½À´Ï´Ù.
Target(Bonding)
-
Àû¿ëºÐ¾ß
¹ÝµµÃ¼ ¹× µð½ºÇ÷¹ÀÌ
-
¼ÒÀç
Cu, Ti, Mo, Ag, Al, Ta, etc
-
Çü»ó
Flat Type, Rotary Type
Flat Type |
Thickness | Width | Length | Rotary Type |
Out diameter | In diameter | Length |
---|---|---|---|---|---|---|---|
5~100 | 3,000 | 4,000 | 100~350 | 50~350 | 4,000 |
º¸À¯±â¼ú
°¡°ø, Bonding, Ultrasonic, ¿ëÁ¢(Tig)
-
- Flat Target -
-
- Rotary Target -
-
- Target Bonding -
Backing Plate
-
Àû¿ëºÐ¾ß
¹ÝµµÃ¼ ¹× µð½ºÇ÷¹ÀÌ
-
¼ÒÀç
Cu, Ti, Mo, Ag, Al, Ta, etc
-
Çü»ó
Flat Type, Rotary Type
• Specification
(´ÜÀ§:mm) | (´ÜÀ§:mm) | ||||||
Flat Type |
Thickness | Width | Length | Rotary Type |
Out diameter | In diameter | Length |
---|---|---|---|---|---|---|---|
10~100 | 3,000 | 4,000 | 100~350 | 50~350 | 4,000 |
º¸À¯±â¼ú
°¡°ø, ¿ëÁ¢(FSW), ÈÚ±³Á¤
-
- Target Bonding -
-
- Backing Plate -
-
- Backing Plate -