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Target Service

Machining Bonding FSW

YMC Co., Ltd. provides sputtering targets in various materials and size, Sputtering target is used for forming wiring film of flat panel display. Also, YMC has localized backing plate – target assembly unit/water cooler – for the first time in Korea with high competitiveness, Bonding technology, which is as essential process for manufacturing target and backing plate, can apply to the largest size of the parts in Korea based on the accumlated know-how over several years

Target(Bonding)

  • Business Area

    Semiconductor, Display

  • Material

    Cu, Ti, Mo, Ag, Al, Ta, etc

  • Type

    Flat Type, Rotary Type

• Specification
(unit:mm) (unit:mm)
Flat
Type		 Thickness Width Length Rotary
Type		 Out diameter In diameter Length
5~100 3,000 4,000 100~350 50~350 4,000

Technology

Machining, Bonding, Ultrasonic, Welding(Tig)

  • - Flat Target -

  • - Rotary Target -

  • - Target Bonding -

Backing Plate

  • Business Area

    Semiconductor, Display

  • Material

    Cu, Ti, Mo, Ag, Al, Ta, etc

  • Type

    Flat Type, Rotary Type

• Specification
(unit:mm) (unit:mm)
Flat
Type		 Thickness Width Length Rotary
Type		 Out diameter In diameter Length
10~100 3,000 4,000 100~350 50~350 4,000

Technology

Machining, Welding(F.S.W), Warp Correction

  • - Target Bonding -

  • - Backing Plate -

  • - Backing Plate -